PART |
Description |
Maker |
25C320E/P 25C320E/SN 25C320E/ST 25C320E/ST14 25LC3 |
Fuses, 750mA 125V F CHIP 1206 32K的SPI总线串行EEPROM Fuses, 2A 125V F CHIP 1206 32K的SPI总线串行EEPROM SENSOR REFLECTIVE OBJECT 50MA 32K的SPI总线串行EEPROM LED 525NM ROUND GREEN 3MM 32K的SPI总线串行EEPROM 32K SPI Bus Serial EEPROM 32K的SPI总线串行EEPROM Fuses, 4A 125V F CHIP 1206 32K的SPI总线串行EEPROM Fuses, 5A 125V F CHIP 1206 IC Socket Test Clip Connector Type:Plunger Type RoHS Compliant: Yes SENSOR PHOTOLOGIC REFLECTIVE Transformers Only Module Connector Adapter; Convert From:Phone Jack; Convert To:Double Banana Plug; Body Material:Brass; Body Style:Straight RoHS Compliant: Yes Fuses, 375mA 125V F CHIP 1206 Binding Post; Current Rating:3A; Body Material:Phosphor Bronze; Color:Black; Voltage Rating:2500V Fuses, 1.25A 125V F CHIP 1206 Fuses, 1A 125V F CHIP 1206 Fuses, 3.5A 125V F CHIP 1206 Filter Module w/out Resistor Network Fuses, 1.5A 125V F CHIP 1206 Fuses, 2.5A 125V F CHIP 1206
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Microchip Technology, Inc. Microchip Technology Inc.
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1206J6300180KCT 1206J6300180KCR 1206J6300101KCR 12 |
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.000018 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.0001 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.0000015 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.000001 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.000022 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.00015 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.00001 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.001 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.00012 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.0000012 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.00018 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.000012 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.0000018 uF, SURFACE MOUNT, 1206 CHIP
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Syfer Technology, Ltd.
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15-21-G6C-BK1L2VY-2T |
1206 Package Chip LED (1.1 mm Height)
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Everlight Electronics Co., Ltd
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15-21-Y2C-CP1Q2B-2T |
1206 Package Chip LED (1.1 mm Height)
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Everlight Electronics Co., Ltd
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11-21UYOC/S400-A7/TR8 |
1206 Package Chip LEDs with Inner Lens
|
Everlight Electronic Co., Ltd.
|
23-21UYC-S530-A3-TR8 |
1206 Package Chip LED ( 1.1mm Height )
|
Everlight Electronics Co., Ltd
|
EAIST3015A0 |
1206 Package Chip Infrared LED With Inner Lens
|
Everlight Electronics C...
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EAIST3015A1 |
1206 Package Infrared Chip LED With Inner Lens
|
Everlight Electronics C...
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EAIST3015A2 |
1206 Package Chip Infrared LED With Inner Lens
|
Everlight Electronics C...
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23-21SYGC-S530-E2-TR8 |
1206 Package Chip LED ( 1.1mm Height )
|
Everlight Electronics Co., Ltd
|
15-21-T1D-CP1Q2TY-2T |
1206 Package Chip LED (1.0mm Height)
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Everlight Electronics Co., Ltd
|
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